Philips chassis MG2.1E AA 482272721619_a4_en.pdf

Colour television

Chassis

MG2.1 E

Training Manual

Contents

Introduction

Mechanical Instructions

Blockdiagram

Service modes / Compair

Control and Teletext

Power Supply

Tuner and IF

Sound MG2.1E

HIP, I/O select, Video processing

Featurebox (integrated on SSP)

TOPIC

HOP

PTP and Scavem

Line deflection

Frame output stage

Audio amplifiers

Protection structure

Published by CO9870 Television Service Department

Printed in The Netherlands

Copyright reserved 1998 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise

without the prior permission of Philips

Subject to modification

4822 727 21619

©Copyright reserved 1998 Philips Consumer Electronics B.V. Eindhoven, The

stored in a retrieval system or transmitted, in any form or by any means, electron-

ic, mechanical, photocopying, or otherwise without the prior permission of Philips

Published by CO9870 Television Service DepartmentPrinted in The Netherlands

Subject to modification

4822 727 21619

Chapter 1

MG2.1 E

Introduction

Chapter 1 Introduction

Introduction

European eco 100 Hz

The MG project includes all developments of high-end for Eu-

rope, Asia and America (Global = all over the world one chas-

sis). With this concept a large range of TV-sets are possible:

50Hz, 100Hz, PAL+, SVGA, etc.... MG consist of two basic con-

cepts: low- and high-end architecture. A big difference with pre-

vious chassis is the high integration of function into IC's.

• LOW architecture: FBX is flat (integrated) on SSP

• Not real AUTO TV, however many picture improvements

are automatic

• Source selection with 2 Scarts

• No comb filter, no TOPIC, sometimes scavem

• No Dolby, audio amplifier 2 X 15 W

• NextView from the received channel

• FL8 styling

Specs dependent of the region:

Europe

European Medium (digital scan)

• Source select for 2 till 4 scarts

• Mostly 100 Hz and 16:9

• No PIP but dual screen for the top-range

• Philips CRT

• Easylink (P50) and nexTView (EPG) with or without

flashram

• Tuner and IF suitable for all European standards

• A lot of possibilities for picture and sound

• AUTO TV, via a lightsensor to the TOPIC, the PICNIC and

PROZONIC settings are controlled

• Source select with 3 Scarts

• Combfilter, TOPIC and Scavem

• Dual screen TXT in 16/9 sets

• Virtual Dolby audio amplifier 4 X 15 W

• Full Nextview

• FL7 styling

AP (Asia + Latin America)

European TOP 100 Hz

• Cinch source select

• Mostly 1Fh (60 Hz) sets

• Mostly 4:3 applications

• Siemens PIP, dual screen optional

• Various Asian and Latam standards, country dependent

• All features of medium-range and extra features added:

• HIGH architecture, separate FBX (module)

• Most sets 4 Scarts

• Pal plus in 16/9-sets

• Full Dolby or cordless dolby-surround (optional MCS)

• 4 X 15W + 2 X 8 W amplifiers (= multi channel sound)

• FL7 or FL9 styling

USA

• TOP sets

• Cinch Source select

• Digital Dolby: Multi Channel Sound (MCS) This is a digital

sound systeem (MPEG or AC3) with max 6 channels audio

• 2Fh, 1Fv (60 Hz)

• Decoder for MPEG video

• Dual screen

AP 1 Fh (50 Hz or 60 Hz)

• Always 1 Fh mostly 60 Hz, for some regions 50 Hz

• LOW architecture for LSP

• AUTO TV , TOPIC with lightsensor

• AP source select with cinch-plugs

• Comb filter, Scavem

• PIP present

• Virtual Dolby

• FL7 styling

General note: The MG project includes also panels for Projec-

tion- or Flat-TV

Type number description; First two digits for tube size:

EUROPEAN 50 Hz

Lettercombination PT = 4 : 3 PW = 16 : 9

• PICNIC for AARA in 16/9

• Low architecture

• Auto TV with TOPIC

• Source Select 3 scarts.

• Combfilter, Scavem

• Dual Screen TXT

• Dolby

• Nextview of the received channel

• FL8 styling

First digit 6 = 50 Hz or 60 Hz

7 = ECO 100 Hz AABB; 8 = DIG SCAN

9 = Natural motion/progressive Scan

Second digit, (the higher the number- the higher the specs)

Second European TOP 100 Hz

Third digit: 0 = no dolby; 1 = dolby and Fourth digit 4 = Pro-

gram 98; 5 = Program 99; 8 = AP

• Dual Screen

• Cordless Dolby-surround with MCS (multi channel sound)

With the MG-chassis various sets are possible:

MG2.1 E

Chapter 2

Mechanical instructions

Chapter 2 Mechanical instructions

Removing the rear cover

2. Remove I/O-backplate by releasing snap at left side. Pull to

left and backwards. The I/O-bracket hinges at the right side.

It can be removed now.

3. Pull backwards (about 8 cm) the bracket with the SSP and

the LSP. These brackets are not fixed to each other, but can

be repositioned backwards, as if they were one bracket.

4. Hook the brackets in the first row of fixation-holes of the bot-

tom tray; see figure 4.3. In other words re-position the fixa-

tion from (1) TO (2)

Side I/O assembly

SSP - bracket

LSP - topbracket

LSP - bracket

A A

CL 86532042_001.AI

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1. Remove the fixation screws (A) of the rear cover, notice

also the side-I/O-screw; see figure 4.1 (A') screw only valid

for 3-scart configuration.

2. Remove the rear cover.

Bottom tray

Service positions

CL 86532042_002.AI

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There are two predefined service positions

Service position bottom side (only for LSP)

1. Service position for the top side (component-side)

2. Service position for the bottom side (only valid for LSP)

(copper-side)

Service position top side

CL 86532042_005.ai

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CL 86532042_003.ai

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1. Remove 1 screw in case of 2-scart I/O-backplate and 2

screws in case of a 3-scart I/O-backplate. (See figure 4.2)

Chapter 2

MG2.1 E

Mechanical instructions

Removing the SSP from SSP-bracket

1. Release the three fixation clamps on the right hand side of

the bracket

2. Press the board upwards and remove the board from the

bracket

Removing the LSP from LSP-bracket

1. Release the two fixation clamps on the right hand side of the

bracket

2. Press the board upwards and remove the board from the

bracket

CL 86532042_004.AI

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Removing the top control board

1. Referring to previous Service position one must remove the

SSP and LSP from bottom tray by pulling back these two

panels.

2. Disconnect the SSP from the LSP bracket

3. The two panels must be shifted some 25 cm to the right.

When doing this the side-assembly can be taken out of the

hinge (see figure 4.4), and placed on the bottom tray.

4. Either the LSP-topbracket must be removed first, or the ca-

bling from SSP to LSP (0310 and O311) must be re-routed

outside the LSP-topbracket to get room to position these

panels

5. Turn the LSP 90 degrees anti clock wise and place the LSP

in the hole of the bottom tray. If needed a screw can rein-

force the stability of this position. (see figure 4.5) (See (2).

6. The left front hook of the SSP panel can be fixed in a fixa-

tion-hole, that was used in previous service-position for the

right front hook of the SSP. See described movement-ac-

tion (1). (there is no right fixation hole)

Top control board

CL 86532042_006.ai

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1. See figure 4.6. Pull 2 clamps to the outer side

2. Top control board can be pushed down now, while it hinges

still in the front

3. Now the board can be pulled backwards

4. (If by accident the hinge in front is damaged or one of the

clamps is broken, the top control board can also be fixed by

2 screws)

Service position bottom side SSP

Removing the side I/O board

1. In fact there is no service position for the bottom of the SSP.

Almost all components are present on the component-side.

All test points are located on the component-side.

2. If ICs must be replaced take the complete panel out. If still

a service-position is needed take SSP out of bracket and ro-

tate it so that one (sitting behind the set) sees the copper-

side of the SSP, with Tuner pointed to the upper-side.

1. The complete Side I/O-assembly can be lifted out of the

hinges and placed on the bottom tray of the set. (see fig 4.3)

2. The pcb can easily be removed out of the bracket by releas-

ing the fixation clamps

Removing the mains switch/LED board

Removing the LSP-top bracket

1. Release the two fixation clamps

2. Pull the board backwards

1. (See figure 4.3). Remove the two fixation screws of the

LSP-topbracket (one on the left hand side, one on the right

hand side)

2. Disconnect wirings from cable-clamps of LSP-topbracket

3. In case the line transformer is changed by a bigger type a

part of the LSP-topbracket can be removed by breaking it

Mounting the rear cover

Before mounting the rear cover, check whether the mains cord

is mounted correctly in the guiding brackets

MG2.1 E

Chapter 3

Blockdiagram

Chapter 3 Blockdiagram

Fig. 3.1

CL 86532047_001.eps

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Chassis name

• service default mode (SDM). Predefined state of the set.

• service alignment mode (SAM) to do all kind of alignments,

select test patterns, display error codes,....

• full support of the dealer service tool (DST).

The 'MG' chassis is the successor of the MD1, MD2, GFL-chas-

sis. The MG architecture is global and can be produced all over

the world.

New tools and service features

Explanation chassis name MGX.YZ

Xdepends on specification

A lot of additional service "features" are built in the MG2.1E.

These "features" can be addressed with a new tool called

ComPair (Computer Aided Repair). This is an interface that can

receive the error codes and can send RC5 and RC6-codes. To

this interface belongs also software and a CD-ROM with the

service manual, circuit descriptions and fault finding trees. In

this way searching for components on the PCB and schematics

is history.

Ydepends on introduction-timing

Zregion e.g. E(urope); A(sia Pacific); U(SA)

This manual deals with the MG2.1E.

A small signal panel (SSP) is used and a large signal panel

(LSP). On the LSP there are only a few SMD's, but the SSP is

further integrated. There are no modules anymore; the FBX

(feature-box) is integrated on the chassis. Due to the fact that

all features are flat on one board, repair down to component

level is an absolute must.

Explanation Small Signal (fig 3.1). The tuner type UV1316 is a

PLL tuner and delivers the IF-signal to the HIP (High-end Input

Processor (TDA9320H)). The HIP has the following functions:

• IF-part

• video source select and record select

• colour decoder (PAL/SECAM/NTSC)

• synchronisation

For this reason there is a lot of diagnostic support built-in in the

chassis:

Three scart connectors can be used. Scart 1 and 2 are full scart

and scart 3 is only cvbs. Scart 2 is meant for VCR, thus on this

scartpin 10 is used for Easylink and there is possibility for y/c

• customer service mode (CSM) as used in the MD2.2-chas-

sis. It decreases the number of nuisance calls.

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