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Microsoft Word - _DOC-00045694_Blackstone_SM_A01_Nov.6 08.doc
Doc. No. DOC-00045694 REV.
HTC Corporation
Issued Date
2008/8/21
A01
.
Revised Date 2008/11/6
Doc. Title
Blackstone Service Manual
Page
1 of 96
Blackstone
Service Manual
HTC Proprietary
Confidential Treatment Requested
Rev. A01
HTC Corp.
Engineering Mobility
HTC CONFIDENTIAL
SM-TP001-0704
U
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Doc. No. DOC-00045694 REV.
HTC Corporation
Issued Date
2008/8/21
A01
.
Revised Date 2008/11/6
Doc. Title
Blackstone Service Manual
Page
2 of 96
REVISION CONTROL TABLE
REV
DATE
CONTENTS
DEPT.
REVISED
STAGE
AX01
2008/8/21 Fist Draft.
PSE
Leo Wei
DVT
AX02
2008/10/21 Chapter 3 to 10 are created in SM.
PSE
Leo Wei
PVT
A01
2008/11/06
1. Chapter 4.1 added the engineer ID in
diagnostic program.
2. Chapter 5.2 added the value for Idle/sleep
current test.
3. Chapter 9.2 revised the L2.5 component part.
PSE
Leo Wei
MV
HTC CONFIDENTIAL
SM-TP001-0704
141467871.002.png 141467871.003.png 141467871.004.png 141467871.005.png
Doc. No. DOC-00045694 REV.
HTC Corporation
Issued Date
2008/8/21
A01
.
Revised Date 2008/11/6
Doc. Title
Blackstone Service Manual
Page
3 of 96
1. INTRODUCTION ....................................................................................................................................................................4
1.1 P RODUCT F EATURES ..........................................................................................................................................5
1.2 P RODUCT OVERVIEW ........................................................................................................................................10
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................17
2.1 T OOLS LIST ......................................................................................................................................................17
2.2 D ISASSEMBLING PROCEDURE ............................................................................................................................18
2.3 A SSEMBLING PROCEDURE ................................................................................................................................28
3. ROM RE-FLASH PROCEDURE ........................................................................................................................................42
3.1 ROM UPGRADE THRU RUU (R E - FLASH U PGRADE U TILITY ) ................................................................................42
3.2 ROM I MAGE UPGRADE THRU SD CARD .............................................................................................................46
4. DIAGNOSTIC PROGRAM ..................................................................................................................................................48
4.1 L IST OF D IAGNOSTIC T EST I TEMS ......................................................................................................................48
5. POWER MEASUREMENT TEST ......................................................................................................................................62
5.1 M AIN BOARD LEAKAGE CURRENT T EST P ROCEDURE ..........................................................................................62
5.2 B ATTERY RUNDOWN TEST PROCEDURE ..............................................................................................................66
6. COSMETIC INSPECTION CRITERIA ...............................................................................................................................71
6.1 C LASSES DEFINITION OF INSPECTIVE AREA .........................................................................................................71
6.2 D ISPLAY INSPECTION ........................................................................................................................................74
6.3 M AIN UNIT INSPECTION .....................................................................................................................................75
7. GENERIC TROUBLESHOOTING .....................................................................................................................................78
8. GENERIC LABELING PLAN ..............................................................................................................................................83
9. GENERIC SPARE PART LIST AND PHOTOS ................................................................................................................87
9.1 SPL FOR R EPAIR ..............................................................................................................................................87
9.2 B OARD L EVEL 2.5 R EPAIRS ..............................................................................................................................92
10. RF ANTENNA SPECIFICATION ...................................................................................................................................95
HTC CONFIDENTIAL
SM-TP001-0704
141467871.006.png 141467871.007.png 141467871.008.png 141467871.009.png
Doc. No. DOC-00045694 REV.
HTC Corporation
Issued Date
2008/8/21
A01
.
Revised Date 2008/11/6
Doc. Title
Blackstone Service Manual
Page
4 of 96
1. Introduction
This manual provides the technical information to support the service activities of this product.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
reading this chapter, you will know what feature the product has and basic hardware
operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
z Chapter 2: Device Disassembling and Assembling Procedure- After reading this chapter, you will
learn how to disassemble and assemble the product. Also, you will know what tools to
use and the torque. Please follow the instruction to disassemble the unit to prevent
from damaging the unit.
z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of
enter the boot loader mode.
z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
z How to use the diagnostic program to perform unit function test
z How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…)
z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc…
z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic
trouble-shooting.
z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc…
z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
z Chapter 10: RF Antenna Specification- Reference Spec for RF test.
HTC CONFIDENTIAL
SM-TP001-0704
141467871.010.png 141467871.011.png 141467871.012.png 141467871.013.png
Doc. No. DOC-00045694 REV.
HTC Corporation
Issued Date
2008/8/21
A01
.
Revised Date 2008/11/6
Doc. Title
Blackstone Service Manual
Page
5 of 96
1.1 Product Features
HTC CONFIDENTIAL
SM-TP001-0704
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