PROCESS FLOW.pdf
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168 KB
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Title
Process Flow, Electrical
Process Flow, Electrical
Applicable for V800/ V802se
Contents
1
Process Flow, HVC ......................................................................................................... 2
1.1
1.2
Block Diagram................................................................................................... 2
2
Revision History .............................................................................................................. 4
00021-2/FEA 209 544/88 B
Company Internal
Sony Ericsson Mobile Communications AB
Approved according to 000 21-LXE 107 42/1
Textual Description ........................................................................................... 3
Process Flow
,
Electrical
1 ProcessFlow
This document is about the Electrical Process Flow in the HVC. First in this document there
is a block diagram followed by a textual description of the flow.
1.1
Block Diagram
The Process Flow follows the Block Diagram below:
Unit in
No trouble found
or SW fault
Determine
fault
HW fault
Trouble shoot
Fault not repairable on
this level or cause of
failure not found
Repair
Fault not repairable on
this level
SW upgrade to
latest revision
if needed
Failure
Test
OK
Unit out
Next repair
level
00021-2/FEA 209 544/88 B
Company Internal
Sony Ericsson Mobile Communications AB
2(4)
Process Flow
,
Electrical
1.2
Textual Description
The Process Flow follows the Textual Description below:
Box
Reference
Unit in
Process the phone according to local requirements.
Determine fault
Determine if the phone is faulty or not and if it possible confirm the
customerÓs complaint.
If a
HW
fault is found, or a HW
and
SW fault is found, continue
with
Trouble shoot.
If only a SW fault is found
Software upgrade to latest revision,
continue to
Test,
and
Unit out. Report as
SW upgrade
If no HW or SW fault is found, continue to
Software upgrade to
latest revision,
continue to
Test,
and
Unit out.
Report as
No Trouble Found, NTF.
Trouble shoot
Trouble Shooting Guide, Mechanical and Electrical
Determine the cause of the failure. Trouble-shoot the phone
according to the guide for the most common faults.
Repair
Working Instruction Mechanical and Electrical
Repair the faulty phone according to the instruction. Replace parts as
required.
(Product Change Survey, Mechanical)
Flashing the latest software into the phone at this point may ÐrepairÑ
some problems.
If a repair that requires calibration has been done, calibrate the unit
in SERP.
Calibration can only be done by authorized repair locations.
SW upgrade to latest
revision if needed
Control the SW revision in the product, update to latest revision if
needed.
Test
Test Instruction, Electrical
To verify that the phone works, all test actions must be performed.
Unit Out
Process and package the phone according to local requirements.
Next Repair Level
If the cause of the failure cannot be found or is not repairable at this
level, the phone can be Scrapped, Swapped or returned to the
customer at the customerÓs request.
Scrap:
According to local directives
Swap:
Swap the phone according to the instruction in
Working
Instructions, Swap and Customize
and according to local directives
00021-2/FEA 209 544/88 B
Company Internal
Sony Ericsson Mobile Communications AB
3(4)
Process Flow
,
Electrical
2 RevisionHistory
The revision history of the process flow in the HVC is as follows:
Rev. Date
Changes / Comments
A
2004-11-26
First Release
B
2004-12-16
Due to system problem
00021-2/FEA 209 544/88 B
Company Internal
Sony Ericsson Mobile Communications AB
4(4)
Plik z chomika:
misiekyo
Inne pliki z tego folderu:
WORKING INSTRUCTION.pdf
(577 KB)
TROUBLE SHOOTING GUIDE.pdf
(147 KB)
PROCESS FLOW.pdf
(168 KB)
PART LIST.pdf
(121 KB)
INSTALLATION INSTRUCTION.pdf
(339 KB)
Inne foldery tego chomika:
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