PHILIPS LC4.1E_AB_312278515310.pdf

Colour Television

Chassis

LC4.1 AB

E_14520_000.eps

170904

Contents

Page

Contents

Page

1. Technical Specifications, Connections, and Chassis

Overview 2

2. Safety Instructions, Warnings, and Notes 5

3. Directions for Use 7

4. Mechanical Instructions 8

5. Service Modes, Error Codes, and Fault Finding 10

6. Block Diagrams, Testpoint Overviews, and

Waveforms

Wiring Diagram

8. Alignments 45

9. Circuit Descriptions, Abbreviation List, and IC Data

Sheets

Abbreviation List

IC Data Sheets

10. Spare Parts List

11. Revision List

Block Diagram Audio & Video

Block Diagram Scaler & Supply

Testpoint Overview SSB (Top Side)

Testpoint Overview SSB (Bottom Side)

Testpoint Overview Front IR / LED Panel

I2C Overview

Supply Voltage Overview

7. Circuit Diagrams and PWB Layouts

Drawing PWB

SSB: Tuner + VIF

(B1) 25

35-36

SSB: Hercules

(B2) 26

35-36

SSB: Hercules

(B3) 27

35-36

SSB: Audio Amplifier + Processing

(B4) 28

35-36

SSB: TV Supply

(B5) 29

35-36

SSB: Scaler

(B6) 30

35-36

SSB: Scaler

(B7) 31

35-36

SSB: Scaler I/O

(B8) 32

35-36

SSB: Supply

(B9) 33

35-36

SSB: Rear I/O Scart

(B10) 34

35-36

Side I/O Panel

(D) 37

Keyboard Control Panel

(E) 39

Top Control Panel

(E) 40

Audio Amplifier

(I) 41

Front IR / LED Panel

(J) 43

EN 2

LC4.1E AB

Technical Specifications, Connections, and Chassis Overview

1. Technical Specifications, Connections, and Chassis Overview

Index of this chapter:

1.1 Technical Specifications

1.2 Connection Overview

1.3 Chassis Overview

- Mains frequency (Hz)

: 50 / 60

Ambient conditions:

- Temperature range ( ° C)

: +5 to +45

- Maximum humidity

: 90% R.H.

Notes:

• Figures can deviate due to the different set executions.

• Specifications are indicative (subject to change).

Power consumption (values are indicative)

- Normal operation (W)

: ≈ 42/53/55/80/92

- Stand-by (W)

: < 1/1.5/3

1.1 Technical Specifications

Dimensions (WxHxD cm)

: 46.7x30.7x6.9

: 47.2x30.8x7.65

: 51.7x30.2x8

: 58.3x38.6x8.7

: 61.8x32.5x9

: 71.6x37.5x9.8

1.1.1 Vision

Display type

: LCD, IPS / LCD, TN

Screen size

: 15” (38 cm), 4:3

: 17” (43 cm), 16:9

: 20” (51 cm), 4:3

: 20” (51 cm), 16:9

: 23” (58 cm), 16:9

Weight (kg)

: 5.8/6/8.8/10.2

Resolution (HxV pixels)

: 640x480

: 1024x768

: 1280x768

: 1366x768

1.2 Connection Overview

Note: The following connector colour abbreviations are used

(acc. to DIN/IEC 757): Bk= Black, Bu= Blue, Gn= Green, Gy=

Grey, Rd= Red, Wh= White, and Ye= Yellow.

Contrast ratio

: 350/500/600:1

Light output (cd/m 2 )

: 450

Response time (ms)

: 16/25

1.2.1 Front / Side Connections

Viewing angle (HxV degrees)

: 130x100

: 140x120

: 176x176

Tuning system

: PLL

HEADPHONE

TV Colour systems

: PAL B/G, D/K, I

: SECAM B/G, D/K, L/L’

: NTSC M/N 3.58

AUDIO R IN

AUDIO L IN

Video playback

: NTSC M/N 3.58, 4.43

: PAL B/G

: SECAM L/L’

VIDEO IN

S-VIDEO

Supported computer formats

: VGA (640x480)

: VGA (720x400)

: VGA (640x350)

: MAC (640x480)

: MAC (832x624)

: SVGA (800x600)

: XVGA (1024x768)

: WXGA (1280x768)

DVI

AUDIO IN

F_15310_032.eps

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Figure 1-1 Side I/O

1.2.2 Rear Connections

Supported video formats

: 640x480i - 1fH

: 720x576i - 1fH

: 1920x1080i - 2fH

: 1280x720p - 3fH

ComPair

CONNECTOR

AERIAL IN

FM ANT

SCART 1

DVI

Presets/channels

: 100 presets

Tuner bands

: VHF

: UHF

: S-band

: Hyper-band

: FM-radio (depending

on model)

F_15310_031.eps

270605

1.1.2 Sound

Figure 1-2 Rear I/O

Technical Specifications, Connections, and Chassis Overview

LC4.1E AB

EN 3

S-Video (Hosiden): Video Y/C - In

1 - Ground Y

5-D+

Gnd

6 - DDC_SCL

DDC clock

2 - Ground C

Gnd

7 - DDC_SDA

DDC data

3 - Video Y

1 V PP / 75 ohm

8-..

4 - Video C

0.3 V PP P / 75 ohm

9-D-

10 - D1+

Mini Jack: Audio Head phone - Out

Bk - Head phone

11 - Shield

Gnd

32 - 600 ohm / 10 mW

12 - D3-

13 - D3+

Service Connector (ComPair)

1 - SDA-S

14 - +5V

I 2 C Data (0 - 5 V)

15 - Ground

Gnd

16 - HPD

Hot Plug Detect

2 - SCL-S

I 2 C Clock (0 - 5 V)

17 - D0-

3 - Ground

Gnd

18 - D0+

Service Connector (UART)

1 - UART_TX

19 - Shield

Gnd

Transmit

20 - D5-

21 - D5+

2 - Ground

Gnd

22 - Shield

Gnd

3 - UART_RX

Receive

23 - CLK+

24 - CLK-

Mini jack: DVI Audio - In

1 - Audio - R

DVI-I: Digital/Analogue Video - In (depending on model)

2 - Audio - L

3 - Ground

Gnd

C1 C2

C3 C4

E_06532_004.eps

050404

EXT1: Video RGB/YC - In, CVBS - In/Out, Audio - In/Out

Figure 1-5 DVI-I connector

1-D-

2-D+

3 - Shield

Gnd

E_06532_001.eps

050404

4-D-

5-D+

Figure 1-3 SCART connector

6 - DDC_SCL

DDC clock

7 - DDC_SDA

DDC data

8 - V-sync

0 - 5 V

1 - Audio R

0.5 V RMS / 1 kohm

9-D-

2 - Audio R

0.5 V RMS / 10 kohm

10 - D1+

3 - Audio L

0.5 V RMS / 1 kohm

11 - Shield

Gnd

4 - Ground Audio

Gnd

12 - D3-

5 - Ground Blue

Gnd

13 - D3+

6 - Audio L

0.5 V RMS / 10 kohm

14 - +5V

7 - Video Blue/C-out 0.7 V PP / 75 ohm

15 - Ground

Gnd

8 - Function Select 0 - 2 V: INT

4.5 - 7 V: EXT 16:9

9.5 - 12 V: EXT 4:3

16 - HPD

Hot Plug Detect

17 - D0-

18 - D0+

9 - Ground Green Gnd

19 - Shield

Gnd

10 - n.c.

20 - D5-

11 - Video Green

0.7 V PP / 75 ohm

21 - D5+

12 - n.c.

22 - Shield

Gnd

13 - Ground Red

Gnd

23 - CLK+

14 - Ground P50

Gnd

24 - CLK-

15 - Video Red/C

0.7 V PP / 75 ohm

C1 - Video Red

0.7 V PP / 75 ohm

16 - Status/FBL

0 - 0.4 V: INT

1 - 3 V: EXT / 75 ohm

C2 - Video Green

0.7 V PP / 75 ohm

C3 - Video Blue

0.7 V PP / 75 ohm

17 - Ground Video

Gnd

C4 - H-sync

0 - 5 V

18 - Ground FBL

Gnd

C5 - Ground

Gnd

19 - Video CVBS

1 V PP / 75 ohm

20 - Video CVBS/Y 1 V PP / 75 ohm

21 - Shield

Gnd

EN 4

LC4.1E AB

Technical Specifications, Connections, and Chassis Overview

1.3 Chassis Overview

TOP CONTROL PANEL

LCD PANEL

TV & SCALER

BOARD

AMPLIFIER

PANEL

FRONT IR / LED

PANEL

SIDE IO PANEL

POWER SUPPLY

UNIT

F_15310_033.eps

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Figure 1-6 PWB locations (depending on model)

Safety Instructions, Warnings, and Notes

LC4.1E AB

EN 5

2. Safety Instructions, Warnings, and Notes

Index of this chapter:

2.1 Safety Instructions

2.2 Warnings

2.3 Notes

Service Default Mode (see chapter 5) with a colour bar

signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated

otherwise) and picture carrier at 475.25 MHz for PAL, or

61.25 MHz for NTSC (channel 3).

• Where necessary, measure the waveforms and voltages

with ( ) and without ( ) aerial signal. Measure the

voltages in the power supply section both in normal

operation ( ) and in stand-by ( ). These values are

indicated by means of the appropriate symbols.

• The semiconductors indicated in the circuit diagram and in

the parts lists, are interchangeable per position with the

semiconductors in the unit, irrespective of the type

indication on these semiconductors.

2.1 Safety Instructions

Safety regulations require the following during a repair:

• Connect the set to the Mains/AC Power via an isolation

transformer (> 800 VA).

• Replace safety components, indicated by the symbol ,

only by components identical to the original ones. Any

other component substitution (other than original type) may

increase risk of fire or electrical shock hazard.

2.3.2 Schematic Notes

Safety regulations require that after a repair, the set must be

returned in its original condition. Pay in particular attention to

the following points:

• Route the wire trees correctly and fix them with the

mounted cable clamps.

• Check the insulation of the Mains/AC Power lead for

external damage.

• Check the strain relief of the Mains/AC Power cord for

proper function.

• Check the electrical DC resistance between the Mains/AC

Power plug and the secondary side (only for sets that have

a Mains/AC Power isolated power supply):

1. Unplug the Mains/AC Power cord and connect a wire

between the two pins of the Mains/AC Power plug.

2. Set the Mains/AC Power switch to the "on" position

(keep the Mains/AC Power cord unplugged!).

3. Measure the resistance value between the pins of the

Mains/AC Power plug and the metal shielding of the

tuner or the aerial connection on the set. The reading

should be between 4.5 Mohm and 12 Mohm.

4. Switch "off" the set, and remove the wire between the

two pins of the Mains/AC Power plug.

• Check the cabinet for defects, to prevent touching of any

inner parts by the customer.

• All resistor values are in ohms, and the value multiplier is

often used to indicate the decimal point location (e.g. 2K2

indicates 2.2 kohm).

• Resistor values with no multiplier may be indicated with

either an "E" or an "R" (e.g. 220E or 220R indicates 220

ohm).

• All capacitor values are given in micro-farads ( µ= x10 -6 ),

nano-farads (n= x10 -9 ), or pico-farads (p= x10 -12 ).

• Capacitor values may also use the value multiplier as the

decimal point indication (e.g. 2p2 indicates 2.2 pF).

• An "asterisk" (*) indicates component usage varies. Refer

to the diversity tables for the correct values.

• The correct component values are listed in the Spare Parts

List. Therefore, always check this list when there is any

doubt.

2.3.3 Rework on BGA (Ball Grid Array) ICs

General

Although (LF)BGA assembly yields are very high, there may

still be a requirement for component rework. By rework, we

mean the process of removing the component from the PWB

and replacing it with a new component. If an (LF)BGA is

removed from a PWB, the solder balls of the component are

deformed drastically so the removed (LF)BGA has to be

discarded.

2.2 Warnings

• All ICs and many other semiconductors are susceptible to

electrostatic discharges (ESD ). Careless handling

during repair can reduce life drastically. Make sure that,

during repair, you are connected with the same potential as

the mass of the set by a wristband with resistance. Keep

components and tools also at this same potential. Available

ESD protection equipment:

– Complete kit ESD3 (small tablemat, wristband,

connection box, extension cable and earth cable) 4822

310 10671.

– Wristband tester 4822 344 13999.

• Be careful during measurements in the high voltage

section.

• Never replace modules or other components while the unit

is switched "on".

Device Removal

As is the case with any component that, is being removed, it is

essential when removing an (LF)BGA, that the board, tracks,

solder lands, or surrounding components are not damaged. To

remove an (LF)BGA, the board must be uniformly heated to a

temperature close to the reflow soldering temperature. A

uniform temperature reduces the risk of warping the PWB.

To do this, we recommend that the board is heated until it is

certain that all the joints are molten. Then carefully pull the

component off the board with a vacuum nozzle. For the

appropriate temperature profiles, see the IC data sheet.

Area Preparation

When the component has been removed, the vacant IC area

must be cleaned before replacing the (LF)BGA.

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