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LM113/LM313 Reference Diode
December 1994
LM113/LM313 Reference Diode
General Description
The LM113/LM313 are temperature compensated, low volt-
age reference diodes. They feature extremely-tight regula-
tion over a wide range of operating currents in addition to an
unusually-low breakdown voltage and good temperature
stability.
The diodes are synthesized using transistors and resistors
in a monolithic integrated circuit. As such, they have the
same low noise and long term stability as modern IC op
amps. Further, output voltage of the reference depends only
on highly-predictable properties of components in the IC; so
they can be manufactured and supplied to tight tolerances.
Y Dynamic impedance of 0.3 X from 500 m Ato20mA
Y Temperature stability typically 1% over b 55 § Cto125 § C
range (LM113), 0 § Cto70 § C (LM313)
Y Tight tolerance: g 5%, g 2% or g 1%
The characteristics of this reference recommend it for use in
bias-regulation circuitry, in low-voltage power supplies or in
battery powered equipment. The fact that the breakdown
voltage is equal to a physical property of siliconÐthe ener-
gy-band gap voltageÐmakes it useful for many tempera-
ture-compensation and temperature-measurement func-
tions.
Features
Y Low breakdown voltage: 1.220V
Schematic and Connection Diagrams
Metal Can Package
Order Number
LM113H, LM113H/883,
LM113-1H, LM113-1H/883,
LM113-2H, LM113-2H/883,
or LM313H
See NS Package Number H02A
TL/H/5713±1
Typical Applications
Low Voltage Regulator
Level Detector for Photodiode
²
Solid tantalum.
TL/H/5713±2
C 1995 National Semiconductor Corporation
TL/H/5713
RRD-B30M115/Printed in U. S. A.
11036285.003.png
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
(Note 3)
Power Dissipation (Note 1)
Storage Temperature Range
b 65 § Cto a 150 § C
Lead Temperature
(Soldering, 10 seconds)
300 § C
100 mW
Operating Temperature Range
LM113
b 55 § Cto a 125 § C
Reverse Current
50 mA
LM313
0 § Cto a 70 § C
Forward Current
50 mA
Electrical Characteristics (Note 2)
Parameter
Conditions
Min
Typ
Max
Units
Reverse Breakdown Voltage
LM113/LM313
I R e 1mA
1.160
1.220
1.280
V
LM113-1
1.210
1.22
1.232
V
LM113-2
1.195
1.22
1.245
V
Reverse Breakdown Voltage
0.5 mA s I R s 20 mA
6.0
15
mV
Change
Reverse Dynamic Impedance
I R e 1 mA
0.2
1.0
X
I R e 10 mA
0.25
0.8
X
Forward Voltage Drop
I F e 1.0 mA
0.67
1.0
V
RMS Noise Voltage
10 Hz s f s 10 kHz
5
m V
I R e 1mA
Reverse Breakdown Voltage
0.5 mA s I R s 10 mA
15
mV
Change with Current
T MIN s T A s T MAX
Breakdown Voltage Temperature
1.0 mA s I R s 10 mA
0.01
%/ § C
Coefficient T MIN s T A s T MAX
Note 1: For operating at elevated temperatures, the device must be derated based on a 150 § C maximum junction and a thermal resistance of 80 § C/W junction to
case or 440 § C/W junction to ambient.
Note 2: These specifications apply for T A e 25 § C, unless stated otherwise. At high currents, breakdown voltage should be measured with lead lengths less than (/4
inch. Kelvin contact sockets are also recommended. The diode should not be operated with shunt capacitances between 200 pF and 0.1 m F, unless isolated by at
least a 100 X resistor, as it may oscillate at some currents.
Note 3: Refer to the following RETS drawings for military specifications: RETS113-1X for LM113-1, RETS113-2X for LM113-2 or RETS113X for LM113.
Typical Performance Characteristics
Temperature Drift
Reverse Dynamic Impedance Reverse Characteristics
TL/H/5713±3
2
11036285.004.png
Typical Performance Characteristics (Continued)
Reverse Characteristics
Reverse Dynamic Impedance Noise Voltage
Forward Characteristics
Response Time
Maximum Shunt Capacitance
TL/H/5713±4
Typical Applications (Continued)
Amplifier Biasing for Constant Gain with Temperature
Constant Current Source
Thermometer
*Adjust for 0V at 0 § C
²
Adjust for 100 mV/ § C
TL/H/5713±5
3
11036285.005.png
 
Physical Dimensions inches (millimeters)
Order Number LM113H, LM113H/883, LM113-1H, LM113-1H/883,
LM113-2H, LM113-2H/883 or LM313H
NS Package Number H02A
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SEMICONDUCTOR CORPORATION. As used herein:
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support device or system whose failure to perform can
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be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance
support device or system, or to affect its safety or
with instructions for use provided in the labeling, can
effectiveness.
be reasonably expected to result in a significant injury
to the user.
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