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LM113/LM313 Reference Diode
December 1994
LM113/LM313 Reference Diode
General Description
The LM113/LM313 are temperature compensated, low volt-
age reference diodes. They feature extremely-tight regula-
tion over a wide range of operating currents in addition to an
unusually-low breakdown voltage and good temperature
stability.
The diodes are synthesized using transistors and resistors
in a monolithic integrated circuit. As such, they have the
same low noise and long term stability as modern IC op
amps. Further, output voltage of the reference depends only
on highly-predictable properties of components in the IC; so
they can be manufactured and supplied to tight tolerances.
Y
Dynamic impedance of 0.3
X
from 500
m
Ato20mA
Y
Temperature stability typically 1% over
b
55
§
Cto125
§
C
range (LM113), 0
§
Cto70
§
C (LM313)
Y
Tight tolerance:
g
5%,
g
2% or
g
1%
The characteristics of this reference recommend it for use in
bias-regulation circuitry, in low-voltage power supplies or in
battery powered equipment. The fact that the breakdown
voltage is equal to a physical property of siliconÐthe ener-
gy-band gap voltageÐmakes it useful for many tempera-
ture-compensation and temperature-measurement func-
tions.
Features
Y
Low breakdown voltage: 1.220V
Schematic and Connection Diagrams
Metal Can Package
Order Number
LM113H, LM113H/883,
LM113-1H, LM113-1H/883,
LM113-2H, LM113-2H/883,
or LM313H
See NS Package Number H02A
TL/H/5713±1
Typical Applications
Low Voltage Regulator
Level Detector for Photodiode
²
Solid tantalum.
TL/H/5713±2
C
1995 National Semiconductor Corporation
TL/H/5713
RRD-B30M115/Printed in U. S. A.
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
(Note 3)
Power Dissipation (Note 1)
Storage Temperature Range
b
65
§
Cto
a
150
§
C
Lead Temperature
(Soldering, 10 seconds)
300
§
C
100 mW
Operating Temperature Range
LM113
b
55
§
Cto
a
125
§
C
Reverse Current
50 mA
LM313
0
§
Cto
a
70
§
C
Forward Current
50 mA
Electrical Characteristics
(Note 2)
Parameter
Conditions
Min
Typ
Max
Units
Reverse Breakdown Voltage
LM113/LM313
I
R
e
1mA
1.160
1.220
1.280
V
LM113-1
1.210
1.22
1.232
V
LM113-2
1.195
1.22
1.245
V
Reverse Breakdown Voltage
0.5 mA
s
I
R
s
20 mA
6.0
15
mV
Change
Reverse Dynamic Impedance
I
R
e
1 mA
0.2
1.0
X
I
R
e
10 mA
0.25
0.8
X
Forward Voltage Drop
I
F
e
1.0 mA
0.67
1.0
V
RMS Noise Voltage
10 Hz
s
f
s
10 kHz
5
m
V
I
R
e
1mA
Reverse Breakdown Voltage
0.5 mA
s
I
R
s
10 mA
15
mV
Change with Current
T
MIN
s
T
A
s
T
MAX
Breakdown Voltage Temperature
1.0 mA
s
I
R
s
10 mA
0.01
%/
§
C
Coefficient T
MIN
s
T
A
s
T
MAX
Note 1: For operating at elevated temperatures, the device must be derated based on a 150
§
C maximum junction and a thermal resistance of 80
§
C/W junction to
case or 440
§
C/W junction to ambient.
Note 2: These specifications apply for T
A
e
25
§
C, unless stated otherwise. At high currents, breakdown voltage should be measured with lead lengths less than
(/4
inch. Kelvin contact sockets are also recommended. The diode should not be operated with shunt capacitances between 200 pF and 0.1
m
F, unless isolated by at
least a 100
X
resistor, as it may oscillate at some currents.
Note 3: Refer to the following RETS drawings for military specifications: RETS113-1X for LM113-1, RETS113-2X for LM113-2 or RETS113X for LM113.
Typical Performance Characteristics
Temperature Drift
Reverse Dynamic Impedance Reverse Characteristics
TL/H/5713±3
2
Typical Performance Characteristics
(Continued)
Reverse Characteristics
Reverse Dynamic Impedance Noise Voltage
Forward Characteristics
Response Time
Maximum Shunt Capacitance
TL/H/5713±4
Typical Applications
(Continued)
Amplifier Biasing for Constant Gain with Temperature
Constant Current Source
Thermometer
*Adjust for 0V at 0
§
C
²
Adjust for 100 mV/
§
C
TL/H/5713±5
3
Physical Dimensions
inches (millimeters)
Order Number LM113H, LM113H/883, LM113-1H, LM113-1H/883,
LM113-2H, LM113-2H/883 or LM313H
NS Package Number H02A
LIFE SUPPORT POLICY
NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant
support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose
be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance
support device or system, or to affect its safety or
with instructions for use provided in the labeling, can
effectiveness.
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
National Semiconductor
National Semiconductor
National Semiconductor
Corporation
Europe
Hong Kong Ltd.
Japan Ltd.
1111 West Bardin Road
Fax: (
a
49) 0-180-530 85 86
13th Floor, Straight Block,
Tel: 81-043-299-2309
Arlington, TX 76017
Email: cnjwge
@
tevm2.nsc.com
Ocean Centre, 5 Canton Rd.
Fax: 81-043-299-2408
Tel: 1(800) 272-9959
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a
49) 0-180-530 85 85
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Fax: 1(800) 737-7018
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a
49) 0-180-532 78 32
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3
ais Tel: (
a
49) 0-180-532 93 58
Tel: (852) 2737-1600
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a
49) 0-180-534 16 80
Fax: (852) 2736-9960
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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