TICP106.PDF

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TICP106 SERIES
SILICON CONTROLLED RECTIFIERS
Copyright © 1997, Power Innovations Limited, UK
MARCH 1988 - REVISED MARCH 1997
l 2 A Continuous On-State Current
LP PACKAGE
(TOP VIEW)
l 15 A Surge-Current
G
A
K
l Glass Passivated Wafer
1
2
3
l 400 V to 600 V Off-State Voltage
l Max I GT of 200 µA
MDC1AA
l Package Options
LP PACKAGE
WITH FORMED LEADS
(TOP VIEW)
PACKAGE
PACKING
PART # SUFFIX
LP
Bulk
(None)
G
LP with fomed leads Tape and Reel
R
1
2
3
A
K
MDC1AB
absolute maximum ratings over operating case temperature (unless otherwise noted)
RATING
SYMBOL
VALUE
UNIT
Repetitive peak off-state voltage (see Note 1)
TICP106D
TICP106M
V DRM
400
600
V
Repetitive peak reverse voltage
TICP106D
TICP106M
V RRM
400
600
V
Continuous on-state current at (or below) 85°C case temperature (see Note 2)
I T(RMS)
2
A
Surge on-state current (see Note 3)
I TSM
15
A
Peak positive gate current (pulse width £ 300 m s)
I GM
0.2
A
Average gate power dissipation (see Note 4)
P G(AV)
0.3
W
Operating case temperature range
T C
-40 to +110
°C
Storage temperature range
T stg
-40 to +125
°C
Lead temperature 3.2 mm from case for 10 seconds
T L
230
°C
NOTES: 1. These values apply when the gate-cathode resistance R GK = 1 k W .
2. These values apply for continuous dc operation with resistive load. Above 85°C derate linearly to zero at 110°C.
3. This value applies for one 50 Hz half-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage
and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium.
4. This value applies for a maximum averaging time of 20 ms.
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
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TICP106 SERIES
SILICON CONTROLLED RECTIFIERS
MARCH 1988 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
I DRM
Repetitive peak
off-state current
V D = rated V DRM
R GK = 1 k W
20
m A
I RRM
Repetitive peak
reverse current
V R = rated V RRM
I G = 0
200
m A
I GT
Gate trigger current
V AA = 6 V
R L = 100 W
t p(g) ‡ 20 m s
60
200
m A
V GT
Gate trigger voltage
V AA = 6 V
R L = 100 W
R GK = 1 k W
t p(g) ‡ 20 µs
0.4
1
V
I H
Holding current
V AA = 6 V
R GK = 1 k W
Initiating I T = 10 mA
5
mA
V TM
Peak on-state
voltage
I TM = 1 A
(see Note 5)
1.5
V
NOTE 5: This parameter must be measured using pulse techniques, t p = 1 ms, duty cycle £ 2 %. Voltage sensing-contacts, separate from
the current carrying contacts, are located within 3.2 mm from the device body.
PRODUCT INFORMATION
2
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TICP106 SERIES
SILICON CONTROLLED RECTIFIERS
MARCH 1988 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92)
LP003 Falls Within JEDEC
TO-226AA Dimensions
5,21
4,44
3,43 MIN.
4,19
3,17
2,67
2,67
2,03
2,03
5,34
Seating Plane
4,32
1,27
(see Note A)
12,7 MIN.
0,56
0,40
1
3
1,40
0,41
1,14
2
0,35
2,67
2,41
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: Lead dimensions are not controlled in this area.
MDXXAX
PRODUCT INFORMATION
3
LP003 Falls Within JEDEC
TO-226AA Dimensions
LP003 (TO-92)
5,21
4,44
4,19
3,43 MIN.
3,17
2,67
2,67
2,03
2,03
5,34
Seating Plane
4,32
1,27
(see Note A)
12,7 MIN.
0,56
0,40
1
3
1,40
0,41
1,14
0,35
2
2,67
2,41
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: Lead dimensions are not controlled in this area.
MDXXAX
11010999.030.png 11010999.001.png 11010999.002.png 11010999.003.png 11010999.004.png 11010999.005.png 11010999.006.png 11010999.007.png 11010999.008.png 11010999.009.png 11010999.010.png 11010999.011.png
TICP106 SERIES
SILICON CONTROLLED RECTIFIERS
MARCH 1988 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92) - Formed Leads Version
LP003 Falls Within JEDEC
TO-226AA Dimensions
5,21
4,44
3,43 MIN.
4,19
3,17
2,67
2,67
2,03
2,03
5,34
4,32
4,00 MAX.
0,56
0,40
1
2
3
2,90
2,40
0,41
0,35
2,90
2,40
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXAR
PRODUCT INFORMATION
4
11010999.012.png 11010999.013.png 11010999.014.png 11010999.015.png 11010999.016.png 11010999.017.png 11010999.018.png 11010999.019.png 11010999.020.png
TICP106 SERIES
SILICON CONTROLLED RECTIFIERS
MARCH 1988 - REVISED MARCH 1997
MECHANICAL DATA
LPR
tape dimensions
LP Package (TO-92) Tape (Formed Lead Version)
5,21
3,43 MIN.
4,19
2,67
2,67
5,34
4, 3 2
4,00 MAX.
0,56
0,41
13,70
32,00
2,50 MIN.
0,50
23,00
27,68
0,00
16,50
17,66
15,50
11,00
9,75
8, 5 0
8, 5 0
19,00
19,00
5,50
17,50
2,90
4,30
2,40
ø
2,90
2,40
3,70
6,75
5,95
13,00
12,40
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXAS
PRODUCT INFORMATION
5
4,44
3,17
2,03
2,03
0,40
0,35
11,70
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