STPS30L40.pdf

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STPS30L40CG/CT/CW
[
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCTS CHARACTERISTICS
I F(AV)
2 x 15 A
A1
V RRM
40 V
K
K
Tj (max)
150
°
C
A2
V F (max)
0.50 V
A2
FEATURES AND BENEFITS
A1
D 2 PAK
STPS30L40CG
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
AVALANCHERATED
DESCRIPTION
Dual
center
tap
schottky rectifiers
suited
for
A2
Switched
Mode
Power
Supplies
and
high
A2
K
K
frequencyDC to DC converters.
Packaged in TO-247, TO-220ABand D 2 PAK these
devices are intended for use in low voltage, high
frequency inverters, free-wheeling and
A1
A1
TO-247
STPS30L40CW
TO-220AB
STPS30L40CT
polarity
protectionapplications.
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
Value
Unit
V RRM
40
V
Repetitive peak reverse voltage
I F(RMS)
30
A
RMS forward current
I F(AV)
15
30
A
Average forward current
Tc = 135 ° C
d = 0.5
Per diode
Per device
I FSM
220
A
Surge non repetitive forward current
tp = 10 ms Sinusoidal
I RRM
1
A
Repetitive peak reverse current
tp=2 m s square F=1kHz
I RSM
3
A
Non repetitive peak reverse current
tp = 100
m
s square
T stg
- 65 to + 150
°
C
Storage temperature range
Tj
150
° C
Maximum operating junction temperature *
dV/dt
10000
V/ m s
Critical rate of rise of reverse voltage
*: dPtot
dTj
1
Rth ( j -
<
thermal runaway condition for a diode on its own heatsink
a
)
July 1999 - Ed: 3A
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STPS30L40CG/CT/CW
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
R th (j-c)
Per diode
Total
1.60
0.85
° C/W
Junction to case
R th (c)
Coupling
0.10
C/W
°
When the diodes 1 and 2 are used simultaneously :
D Tj(diode 1) = P(diode1) x R th(j-c) (Per diode) + P(diode 2) x R th(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
Tests Conditions
Min.
Typ.
Max.
Unit
I R *
360
m A
Reverse leakage
current
Tj = 25 ° C
V R =V RRM
20
50
mA
Tj = 100 ° C
V F *
0.55
V
Forward voltage drop
Tj = 25 ° C
I F =15A
0.42
0.50
Tj = 125 ° C
I F =15A
0.74
Tj = 25 ° C
I F =30A
0.59
0.67
Tj = 125 ° C
I F =30A
Pulse test :
* tp = 380 m s, d <2%
To evaluate the conduction losses use the following equation :
P = 0.330 x I F(AV) + 0.011 I F 2 (RMS)
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
Fig.
2:
Average
current
versus
ambient
temperature ( d =0.5) (per diode).
PF(av)(W)
IF(av)(A)
12
18
d = 0.2
d = 0.5
d = 0.1
16
Rth(j-a)=Rth(j-c)
10
d
= 0.05
14
8
12
d
=1
Rth(j-a)=15
°
C/W
10
6
8
6
4
T
T
4
2
2
Tamb(
°
C)
d
=tp/T
tp
d
tp
=tp/T
IF(av)A
0
0
0
25
50
75
100
125
150
02468 0 2 4 6 8 0
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STPS30L40CG/CT/CW
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values) (per
diode).
Fig. 4: Relative variation of thermal transient
impedance junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
IM(A)
1.0
200
180
0.8
160
140
0.6
d
= 0.5
120
Tc=25
°
C
100
Tc=75
°
C
80
0.4
d
= 0.2
60
Tc=125
°
C
d
= 0.1
T
40
I M
0.2
t(s)
20
Single pulse
t
d =0.5
d
tp(s)
=tp/T
tp
0
1E-3
1E-2
1E-1
1E+0
0.0
1.0E-4
1.0E-3
1.0E-2
1.0E-1
1.0E+0
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values) (per diode).
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values) (per diode).
C(pF)
IR(mA)
2000
2E+2
F=1MHz
Tj=25
1E+2
°
C
Tj=150 ° C
1000
Tj=100 ° C
1E+1
Tj=75
°
C
500
1E+0
1E-1
200
Tj=25 ° C
VR(V)
VR(V)
1E-2
100
0
5
10
15
20
25
30
35
40
1
2
5
10
20
50
Fig.
7:
Forward voltage drop versus
forward
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 m m)
(STPS30L40CGonly).
current (maximum values) (per diode).
IFM(A)
Rth(j-a) (
°
C/W)
200
80
100
Typical values
Tj=150 ° C
70
60
50
40
10
Tj=125 ° C
30
20
Tj=25
°
C
10
S(Cu) (cm )
VFM(V)
1
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
5
10
15
20
25
30
35
40
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STPS30L40CG/CT/CW
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
Millimeters
REF.
Inches
Min.
Max.
Min.
Max.
A
H2
A
4.40
4.60
0.173
0.181
Dia
C
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
L5
L7
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
L6
F2
1.14
1.70
0.044
0.066
L2
G
4.95
5.15
0.194
0.202
F2
G1
2.40
2.70
0.094
0.106
D
H2
10
10.40
0.393
0.409
F1
L9
L2
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L4
L5
2.65
2.95
0.104
0.116
F
L6
15.25
15.75
0.600
0.620
M
L7
6.20
6.60
0.244
0.259
G1
E
L9
3.50
3.93
0.137
0.154
M
2.6 typ.
0.102 typ.
G
Diam.
3.75
3.85
0.147
0.151
Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N
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STPS30L40CG/CT/CW
PACKAGE MECHANICAL DATA
D 2 PAK
DIMENSIONS
Millimeters
REF.
Inches
A
Min.
Max.
Min.
Max.
E
A
4.40
4.60
0.173
0.181
C2
L2
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
D
B2
1.14
1.70
0.045
0.067
L
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
L3
D
8.95
9.35
0.352
0.368
A1
E
10.00
10.40
0.393
0.409
B2
R
G
4.88
5.28
0.192
0.208
C
B
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
G
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A2
R
0.40 typ.
0.016 typ.
V2
0
°
8
°
0
°
8
°
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
Cooling method : by conduction (method C)
FOOT PRINT (in millimeters)
D 2 PAK
16.90
10.30
5.08
1.30
3.70
8.90
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