AMD Thermal, Chassis Cooling Guide.pdf

AMD

Thermal, Mechanical,

and Chassis Cooling

Design Guide

Publication # 23794

Rev: G

Issue Date: March 2002

The contents of this document are provided in connection with Advanced

Micro Devices, Inc. (“AMD”) products. AMD makes no representations or

warranties with respect to the accuracy or completeness of the contents of

this publication and reserves the right to make changes to specifications and

product descriptions at any time without notice. No license, whether express,

implied, arising by estoppel or otherwise, to any intellectual property rights

is granted by this publication. Except as set forth in AMD’s Standard Terms

and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims

any express or implied warranty, relating to its products including, but not

limited to, the implied warranty of merchantability, fitness for a particular

purpose, or infringement of any intellectual property right.

AMD’s products are not designed, intended, authorized or warranted for use

as components in systems intended for surgical implant into the body, or in

other applications intended to support or sustain life, or in any other applica-

tion in which the failure of AMD’s product could create a situation where per-

sonal injury, death, or severe property or environmental damage may occur.

AMD reserves the right to discontinue or make changes to its products at any

time without notice.

Trademarks

AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, and combinations thereof are trademarks of

Advanced Micro Devices, Inc.

Other product names used in this publication are for identification purposes only and may be trademarks of their

respective companies.

AMD Thermal, Mechanical, and Chassis Cooling Design Guide

23794G — March 2002

Table of Contents

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vi

Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

PGA Socket A-Based Processor Thermal Requirements . . . . . . . . . . 2

Socket Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Socket A-Based Processor Specifications . . . . . . . . . . . . . . . . . 4

General Socketed Design Targets . . . . . . . . . . . . . . . . . . . . . . . 5

Suggested Interface Materials . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Sample Socket A Heatsink Drawings . . . . . . . . . . . . . . . . . . . . . 8

Socket A Heatsink Design Considerations . . . . . . . . . . . . . . . . 8

Socketed Motherboard Restrictions. . . . . . . . . . . . . . . . . . . . . 11

Thermocouple Installation for Temperature Testing . . . . . . . . . . . . 14

Thermocouple Positioning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Measuring the Thermocouple Position . . . . . . . . . . . . . . . . . . 15

Drilling Depth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Installing the Thermocouple . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Slot A-Based Processor Specifications . . . . . . . . . . . . . . . . . . . . . . . . 19

General Slot A Design Targets . . . . . . . . . . . . . . . . . . . . . . . . . 19

Sample Slot A Heatsink Drawings . . . . . . . . . . . . . . . . . . . . . . 20

Heatsink Performance Measurements for

Slot A-Based Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Chassis Cooling Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Chassis Airflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Power Supply as Part of the Cooling Solution . . . . . . . . . . . . 27

Rules for Proper Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

iii

AMD Thermal, Mechanical, and Chassis Cooling Design Guide

23794G— March 2002

List of Figures

Figure 1. Socket A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figure 2. Dimensions of Socket A . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Figure 3. Sample Drawing of Socket A Heatsink . . . . . . . . . . . . . . . 8

Figure 4. Heatsink and Load Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 5. Motherboard Keepout Area for a Socket A

AMD Athlon™ Processor Heatsink . . . . . . . . . . . . . . . . . 12

Figure 6. Motherboard Keepout Area for a Socket A

AMD Duron™ Processor Heatsink . . . . . . . . . . . . . . . . . . 13

Figure 7. Drilling for Proper Thermocouple Position. . . . . . . . . . . 14

Figure 8. Measuring Thermocouple Position. . . . . . . . . . . . . . . . . . 15

Figure 9. Bottom View of Heatsink and Drill Depth. . . . . . . . . . . . 16

Figure 10. Injecting Thermal Grease into Drilled Hole . . . . . . . . . . 17

Figure 11. Installed Thermocouple. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 12. AMD Athlon Processor Module Package . . . . . . . . . . . . . 21

Figure 13. Impact Extrusion for Clip Attachment . . . . . . . . . . . . . . 22

Figure 14. Module Heat Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 15. Drill Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 16. Drilled Hole Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 17. Close-Up of Drilled Hole Location . . . . . . . . . . . . . . . . . . 26

Figure 18. Airflow through the Chassis . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 19. Power Supply Venting . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

AMD Thermal, Mechanical, and Chassis Cooling Design Guide

23794G — March 2002

List of Tables

Table 1.

Socketed Processor Specifications for the

AMD Athlon™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Table 2.

Socketed Processor Specifications for the

AMD Duron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Table 3.

General Socketed Thermal Solution Design Target

for the AMD Athlon Processor . . . . . . . . . . . . . . . . . . . . . . 5

Table 4.

General Socketed Thermal Solution Design Target

for the AMD Duron Processor . . . . . . . . . . . . . . . . . . . . . . . 6

Table 5.

Suggested Thermal Interface Materials. . . . . . . . . . . . . . . 7

Table 6.

Slot A Processor Specifications . . . . . . . . . . . . . . . . . . . . 19

Table 7.

General Slot A Thermal Solution Design Targets . . . . . . 20

Plik z chomika:

Inne pliki z tego folderu:

Inne foldery tego chomika: